Display device and method of manufacturing the same

ABSTRACT

A display device includes: an insulating substrate, where a through hole is defined through the insulating substrate; and an organic layer which covers the insulating substrate. In the display device, a barrier area surrounding the through hole is defined in the insulating substrate, and an interruption portion, at which the organic layer is interrupted, is defined in the barrier area.

This application claims priority to Korean Patent Application No.10-2017-0112640, filed on Sep. 4, 2017, and all the benefits accruingtherefrom under 35 U.S.C. 119, the content of which in its entirety isherein incorporated by reference.

BACKGROUND 1. Field

Embodiments of the invention relate to a display device and a method ofmanufacturing the display device.

2. Description of the Related Art

Among various types of display device, an organic light emitting displaydevice has been drawing attention as next-generation display device dueto desired characteristic thereof, e.g., wide viewing angle, highcontrast, and fast response speed.

Generally, an organic light emitting display device includes thin filmtransistors and organic light emitting diodes on a substrate forself-light emission. Such an organic light emitting display device maybe used as a display unit of a small electronic device such as a mobilephone or a display unit of a large electronic device such as atelevision.

In particular, flexible display devices among organic light emittingdisplays are being actively researched as the interest in the flexibledisplay devices increases. In order to realize a flexible displaydevice, a flexible substrate made of a material such as synthetic resinis used instead of a conventional glass substrate.

SUMMARY

However, since a flexible substrate is flexible, it is not easy tohandle the flexible substrate in a manufacturing process. Therefore, theflexible substrate may be formed on a support substrate havingsufficient rigidity for various processes and then may be separated fromthe support substrate, to effectively handle the flexible substrate in amanufacturing process.

Embodiments of the invention provide a display device which preventsmoisture from flowing into a display area.

According to an embodiment of the invention, there is provided a displaydevice including: an insulating substrate, where a through hole isdefined through the insulating substrate; and an organic layer whichcovers the insulating substrate. In such an embodiment, a barrier areasurrounding the through hole is defined in the insulating substrate, andan interruption portion, at which the organic layer is interrupted, isdisposed in the barrier area.

In an embodiment, a groove may be defined on the insulating substrate inthe barrier area.

In an embodiment, the groove may include a first sidewall and a secondsidewall spaced apart from each other, and the interruption portion maybe defined by the first sidewall.

In an embodiment, a slope of the first sidewall and a slope of thesecond sidewall may be substantially the same as each other.

In an embodiment, the display device may further include an electrodewhich covers the organic layer, where the electrode may be interruptedat the interruption portion.

In an embodiment, the electrode may contact the first sidewall and maynot contact the second sidewall.

In an embodiment, a display area, which displays an image, and anon-display area, which is disposed outside the display area, may bedefined in the insulating substrate, and the through hole may be definedin the display area.

In an embodiment, the insulating substrate may include a firstsubstrate, an inorganic layer and a second substrate, which are stackedsequentially one on another, and the groove may be defined in the secondsubstrate.

In an embodiment, a planar shape of the groove may be a ring shapesurrounding the through hole.

In an embodiment, a dam area surrounding the barrier area may be definedin the insulating substrate outside the barrier area, and a dam may bedisposed on the insulating substrate in the dam area.

In an embodiment, the dam may be provided in plural, and the dams mayinclude a first dam and a second dam spaced apart from the first dam.

In an embodiment, a display area, which displays an image, and anon-display area, which is disposed outside the display area, may bedefined in the insulating substrate, and the through hole may be definedin the display area.

In an embodiment, the display area may include a first electrode and asecond electrode opposite to the first electrode, and the organic layermay be disposed between the first electrode and the second electrode.

In an embodiment, the organic layer may include an organic lightemitting layer.

In an embodiment, a display area, which displays an image, and anon-display area, which is disposed outside the display area, may bedefined in the insulating substrate, and the through hole may be definedin the non-display area.

According to another embodiment of the invention, a method ofmanufacturing a display device includes: providing a dam on a first areaof an insulating substrate, where the insulating substrate is disposedon a carrier substrate, and the first area, a second area and a thirdarea are defined in the insulating substrate; forming a laser cuttingportion by irradiating a laser beam to the third area in a firstdirection; forming a groove in the insulating substrate by irradiating alaser beam to the second area in a second direction different from thefirst direction; and providing an organic layer on the insulatingsubstrate to at least partially cover the grooves, where an interruptionportion, at which the organic layer is interrupted, is formed in thesecond area.

In an embodiment, the method may further include: detaching the carriersubstrate from the insulating substrate; and attaching a protective filmto a lower surface of the insulating substrate.

In an embodiment, the method may further include forming a through holeby cutting off a portion of the protective film corresponding to thethird area.

In an embodiment, the groove may include a first sidewall and a secondsidewall spaced apart from each other, and the interruption portion maybe defined by the first sidewall.

In an embodiment, the method may further include providing an electrodeon the insulating substrate to cover the organic layer.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other features of the invention will become apparent andmore readily appreciated from the following description of theembodiments, taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a schematic plan view of a display device according to anembodiment;

FIG. 2 is an enlarged view of a portion ‘A’ of FIG. 1;

FIG. 3 is a cross-sectional view taken along line I-I′ of FIG. 2;

FIG. 4 is a cross-sectional view taken along line II-II′ of FIG. 2;

FIG. 5 is an enlarged view of a portion of FIG. 3;

FIG. 6 is an enlarged view of a portion a display device according to analternative embodiment;

FIG. 7 is a cross-sectional view of a display device according toanother alternative embodiment;

FIG. 8 is a schematic plan view of a display device according to anotheralternative embodiment;

FIG. 9 is an enlarged view of a portion ‘B’ of FIG. 8;

FIG. 10 is a cross-sectional view taken along line III-III′ of FIG. 9;

FIG. 11 is a schematic plan view of a display device according toanother alternative embodiment;

FIG. 12 is an enlarged view of a portion ‘C’ of FIG. 11;

FIGS. 13 to 19 are views illustrating a method of manufacturing adisplay device according to an embodiment; and

FIG. 20 is a plan view illustrating the method of manufacturing adisplay device according to the embodiment.

DETAILED DESCRIPTION

The invention now will be described more fully hereinafter withreference to the accompanying drawings, in which various embodiments areshown. This invention may, however, be embodied in many different forms,and should not be construed as limited to the embodiments set forthherein. Rather, these embodiments are provided so that this disclosurewill be thorough and complete, and will fully convey the scope of theinvention to those skilled in the art. Like reference numerals refer tolike elements throughout.

It will be understood that when an element is referred to as being “on”another element, it can be directly on the other element or interveningelements may be present therebetween. In contrast, when an element isreferred to as being “directly on” another element, there are nointervening elements present.

It will be understood that, although the terms “first,” “second,”“third” etc. may be used herein to describe various elements,components, regions, layers and/or sections, these elements, components,regions, layers and/or sections should not be limited by these terms.These terms are only used to distinguish one element, component, region,layer or section from another element, component, region, layer orsection. Thus, “a first element,” “component,” “region,” “layer” or“section” discussed below could be termed a second element, component,region, layer or section without departing from the teachings herein.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting. As used herein, thesingular forms “a,” “an,” and “the” are intended to include the pluralforms, including “at least one,” unless the content clearly indicatesotherwise. “Or” means “and/or.” As used herein, the term “and/or”includes any and all combinations of one or more of the associatedlisted items. It will be further understood that the terms “comprises”and/or “comprising,” or “includes” and/or “including” when used in thisspecification, specify the presence of stated features, regions,integers, steps, operations, elements, and/or components, but do notpreclude the presence or addition of one or more other features,regions, integers, steps, operations, elements, components, and/orgroups thereof.

Furthermore, relative terms, such as “lower” or “bottom” and “upper” or“top,” may be used herein to describe one element's relationship toanother element as illustrated in the Figures. It will be understoodthat relative terms are intended to encompass different orientations ofthe device in addition to the orientation depicted in the Figures. Forexample, if the device in one of the figures is turned over, elementsdescribed as being on the “lower” side of other elements would then beoriented on “upper” sides of the other elements. The exemplary term“lower,” can therefore, encompasses both an orientation of “lower” and“upper,” depending on the particular orientation of the figure.Similarly, if the device in one of the figures is turned over, elementsdescribed as “below” or “beneath” other elements would then be oriented“above” the other elements. The exemplary terms “below” or “beneath”can, therefore, encompass both an orientation of above and below.

“About” or “approximately” as used herein is inclusive of the statedvalue and means within an acceptable range of deviation for theparticular value as determined by one of ordinary skill in the art,considering the measurement in question and the error associated withmeasurement of the particular quantity (i.e., the limitations of themeasurement system).

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure belongs. It willbe further understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and thepresent disclosure, and will not be interpreted in an idealized oroverly formal sense unless expressly so defined herein.

Exemplary embodiments are described herein with reference to crosssection illustrations that are schematic illustrations of idealizedembodiments. As such, variations from the shapes of the illustrations asa result, for example, of manufacturing techniques and/or tolerances,are to be expected. Thus, embodiments described herein should not beconstrued as limited to the particular shapes of regions as illustratedherein but are to include deviations in shapes that result, for example,from manufacturing. For example, a region illustrated or described asflat may, typically, have rough and/or nonlinear features. Moreover,sharp angles that are illustrated may be rounded. Thus, the regionsillustrated in the figures are schematic in nature and their shapes arenot intended to illustrate the precise shape of a region and are notintended to limit the scope of the present claims.

Hereinafter, embodiments of the invention will be described withreference to the accompanying drawings.

FIG. 1 is a schematic plan view of a display device according to anembodiment. FIG. 2 is an enlarged view of a portion ‘A’ of FIG 1. FIG. 3is a cross-sectional view taken along line I-I′ of FIG. 2. FIG. 4 is across-sectional view taken along line II-II′ of FIG. 2. FIG. 5 is anenlarged view of a portion of FIG. 3.

Referring to FIGS. 1 through 5, an embodiment of the display deviceincludes an insulating substrate 500, through which a through hole H isdefined, and an organic layer EL covering the insulating substrate 500.

The insulating substrate 500 may include a first substrate 501 and asecond substrate 502. In an embodiment, the first substrate 501 and/orthe second substrate 502 may include or be made of at least one ofpolyimide, polyethylene terephthalate (“PET”), polycarbonate,polyethylene naphtalate, polyarylate (“PAR”), and polyetherimide.However, the materials of the first substrate 501 and the secondsubstrate 502 are not limited thereto.

In an alternative embodiment, the insulating substrate 500 may include amaterial such as metal or glass.

In an embodiment, the insulating substrate 500 may be a flexiblesubstrate. In such an embodiment, the insulating substrate 500 may be aflexible substrate that is capable of being bent, rolled or folded.

In an embodiment, the insulating substrate 500 may include the firstsubstrate 501, an inorganic layer 400 and the second substrate 502,which are stacked sequentially one on another (see FIG. 3).

In an embodiment where the insulating substrate 500 is a flexiblesubstrate, the first substrate 501 and the second substrate 502 mayinclude polyimide (“PI”).

In an embodiment, the inorganic layer 400 may include at least one ofsilicon oxide (SiOx), silicon nitride (SiNx) and silicon oxynitride(SiONx).

A display area DA and a non-display area NDA may be defined in theinsulating substrate 500. The display area DA is an area in which animage is displayed, and the non-display area NDA is an area which isdisposed outside the display area DA and in which various signal linesand power supply lines are arranged to display the image in the displayarea DA.

A plurality of pixels (not illustrated) may be defined in the displayarea DA, and a thin film transistor and an organic light emitting diodemay be disposed in each pixel. This will be described later in greaterdetail.

A driver integrated circuit IC may be disposed on a side of thenon-display area NDA. In one embodiment, for example, the driverintegrated circuit IC may be mounted directly on the insulatingsubstrate 500. Although a single driver integrated circuit IC isillustrated in FIG. 1, the number of driver integrated circuits IC isnot limited thereto. In an alternative embodiment, a plurality of driverintegrated circuits IC may be disposed on the non-display area NDA.

The driver integrated circuit IC may generate a plurality of scansignals and/or a plurality of data signals, and provide the scan signalsand/or the data signals to the pixels of the display area DA, in such anembodiment, a plurality of signal lines (not illustrated) forelectrically connecting the driver integrated circuit IC to the pixelsmay be disposed on the insulating substrate 500.

In an embodiment of the display device, the through hole H may bedefined through the insulating substrate 500.

In such an embodiment, the through hole H may form an opening extendingfrom an upper surface to a lower surface of the insulating substrate500.

In an embodiment, the through hole H may be disposed inside the displayarea DA when viewed from a plan view in a thickness direction of thedisplay device. The through hole H and elements disposed adjacent to thethrough hole H will now be described with reference to FIG. 2.

A hole area HA, which is an area occupied by the through hole H, isdefined in the display device. In an embodiment, as shown in FIGS. 1 and2, the planar shape of the through hole H may be a circular shape. In analternative embodiment, the planar shape of the through-hole H may be apolygonal or elliptical shape. In an embodiment, the planar shape of thethrough hole H may be a shape including straight lines and curves.

A barrier area BA may be defined as an area surrounding the through holeH. In an embodiment where the planar shape of the through hole H is acircular shape, an outer boundary of the barrier area BA may becircular. In such an embodiment, the outer boundary of the barrier areaBA may be concentric with an outer boundary of the through hole H.

In such an embodiment, a groove may be disposed in the barrier area BA.

In an embodiment, a first groove GR1, a second groove GR2 and a thirdgroove GR3 may be defined in the barrier area BA of the substrate 500.The first grooves GR1, the second grooves GR2 and the third grooves GR3may be arranged to surround the through hole H. In such an embodiment,the planar shapes of the first groove GR1, the second groove GR2 and thethird groove GR3 may be ring shapes surrounding the through hole H.

In an embodiment, as shown in FIG. 2, three grooves, i.e., the firstgroove GR1, the second groove GR2 and the third groove GR3, are arrangedin the barrier area BA. However, the number of grooves is not limited tothree. In an alternative embodiment, the number of grooves may bevarious modified, e.g., four or more.

In an embodiment, the first groove GR1, the second groove GR2 and thethird groove GR3 may be sequentially arranged outside the through holeH. In an embodiment where the through hole H is circular, the firstgroove GR1, the second groove GR2 and the third groove GR3 may haveshapes of concentric circles that have the center of the through hole Has the center thereof when viewed from the plan view.

A dam area D may be defined as an area surrounding the barrier area BA.In an embodiment, a plurality of dams may be disposed in the dam area D.In an embodiment, a first dam D1 and a second dam D2 may be disposed inthe dam area D, as shown in FIG. 2, but the number of dams is notlimited to two. In an alternative embodiment, the number of dams may beone or may be three or more.

In an embodiment, as described above, the through hole H may be disposedinside the display area DA. In such an embodiment where the through holeH is disposed inside the display area DA, the display area DA may bedisposed outside the dam area D.

The cross-sectional shape of an embodiment of the display device t willnow be described in greater detail with reference to FIGS. 3 and 4.

In an embodiment, as described above, the insulating substrate 500 maybe a flexible substrate. In an embodiment, the insulating substrate 500may include the first substrate 501, the inorganic layer 400 and thesecond substrate 502 stacked sequentially one on another, and the firstsubstrate 501 and the second substrate 502 may include PI.

A buffer layer 100 may be disposed on the second substrate 502. In anembodiment, the buffer layer 100 may be disposed in the display area DAand the dam area D. The buffer layer 100 may not be provided in the holearea HA. The buffer layer 100 may be partially provided in the barrierarea BA or may not be provided in the barrier area. BA.

The buffer layer 100 may effectively prevent impurities passed throughthe second substrate 502 from penetrating into layers thereabove, andmay planarize an upper surface of the second substrate 502.

In an embodiment, the buffer layer 100 may include at least one ofsilicon oxide, silicon nitride, silicon oxynitride, aluminum oxide,aluminum nitride, titanium oxide, and titanium nitride.

In an embodiment, the buffer layer 100 may include at least one ofpolyimide, polyester, and acrylic.

In an embodiment, as shown in FIG. 3, the buffer layer 100 may have asingle layer structure. However, the structure of the buffer layer 100is not limited to the single layer structure. In an alternativeembodiment, the butler layer 100 may have a multi-layer structureincluding a stack of a plurality of functional films.

A semiconductor pattern layer 700 may be disposed on the buffer layer100. In an embodiment, the semiconductor pattern layer 700 may includean inorganic semiconductor such as amorphous silicon or polysilicon. Inan alternative embodiment, the semiconductor pattern layer 700 mayinclude an organic semiconductor or an oxide semiconductor.

In an embodiment, the semiconductor pattern layer 700 may include asource region (not illustrated) and a drain region (not illustrated). Asource electrode SE to be described later may be electrically connectedto the source region of the semiconductor pattern layer 700, and a drainelectrode DE to be described later may be electrically connected to thedrain region of the semiconductor pattern layer 700.

A gate insulating film GI may be disposed on the semiconductor patternlayer 700. The gate insulating film GI may be provided in the displayarea DA and the dam area D. The gate insulating film GI may not beprovided in the hole area HA. The gate insulating film GI may bepartially provided in the barrier area BA or may not be provided in thebarrier area BA.

In an embodiment, an end of the gate insulating film GI and an end ofthe buffer layer 100 may be aligned with each other. In such anembodiment, a sidewall of the gate insulating film GI and a sidewall ofthe buffer layer 100 may be aligned with each other as illustrated inFIG. 3.

In an embodiment, the gate insulating film GI may include at least oneof silicon nitride, silicon oxide, and silicon oxynitride.

A gate electrode GE may be disposed on the gate insulating film GI. Thegate electrode GE may include at least one of an aluminum (Al)-basedmetal including an aluminum alloy, a silver (Ag)-based metal including asilver alloy, a copper (Cu)-based metal including a copper alloy, amolybdenum (Mo)-based metal including a molybdenum alloy, chrome (Cr),titanium (Ti) and tantalum (Ta).

An interlayer insulating film ILD may be disposed on the gate electrodeGE to cover the gate electrode GE. The interlayer insulating film ILDmay be provided in the display region DA and the dam area D. Theinterlayer insulating film ILD may not be provided in the hole area HA.The interlayer insulating film ILD may be partially provided in thebarrier area BA or may not be provided in the barrier area BA.

In an embodiment, an end of the interlayer insulating film ILD and anend of the gate insulating film GI may be aligned with each other. Insuch an embodiment, a sidewall of the interlayer insulating film ILD anda sidewall of the gale insulating film GI may be aligned with eachother. In such an embodiment, the sidewalls of the interlayer insulatingfilm ILD, the gate insulating film GI and the buffer layer 100 may bealigned with each other.

In an embodiment, as shown in FIGS. 3 and 4, the interlayer insulatingfilm ILD is a single film. However, the interlayer insulating film ILDis not necessarily a single film. In an alternative embodiment, theinterlayer insulating film ILD may be a stack of two or more functionallayers.

The source electrode SE and the drain electrode DE are disposed on theinterlayer insulating film ILD. In an embodiment, the interlayerinsulating film ILD may expose the source region and the drain region ofthe semiconductor pattern layer 700, and the source electrode SE and thedrain electrode DE may contact the semiconductor pattern layer 700through the exposed source and drain regions. Accordingly, each of thesource electrode SE and the drain electrode DE may be electricallyconnected to the semiconductor pattern layer 700.

In an embodiment, the gate electrode GE, the source electrode SE, andthe drain electrode DE may collectively define a thin film transistor.

The thin film transistor may be a driving transistor for driving anorganic light emitting diode.

In an embodiment, as shown in FIG. 3, a top gate-type display device inwhich the gate electrode GE is disposed on the semiconductor patternlayer 700 is illustrated. However, the display device is not limited tothe top gate-type display device. In an alternative embodiment, thedisplay device may employ a bottom gate type in which the gate electrodeGE is disposed under the semiconductor pattern layer 700.

A passivation film 600 may be disposed on the source electrode SE, thedrain electrode DE and the interlayer insulating film ILD. Thepassivation film 600 may partially cover the interlayer insulating filmILD. In such an embodiment, the passivation film 600 may partiallyexpose the drain electrode DE.

A first electrode 201, the organic layer EL and a second electrode 202may be disposed on the passivation film 600. The first electrode 201,the organic layer EL and the second electrode 202 may collectivelydefine an organic light emitting diode.

In an embodiment, the first electrode 201 may be an anode. The firstelectrode 201 may be disposed on the passivation film 600 and maycontact the drain electrode DE exposed by the passivation film 600. Insuch an embodiment, the first electrode 201 may be electricallyconnected to the drain electrode DE.

In an embodiment, the first electrode 201 may be a reflective electrode.In such an embodiment, the reflective electrode may include a reflectivefilm including at least one of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir andCr, and a transparent or translucent electrode disposed on thereflective films.

The transparent or translucent electrode may include at least one ofindium in oxide (“ITO”), indium zinc oxide (“IZO”), zinc oxide (ZnO),indium oxide (In₂O₃), indium gallium oxide (“IGO”), and aluminum zincoxide (“AZO”).

A pixel defining layer PDL including an insulating material may bedisposed on the first electrode 201. The pixel defining layer PDL mayexpose at least part of the first electrode 201.

The organic layer EL may be disposed on the pixel defining layer PDL andthe first electrode 201. The organic layer EL may include an organiclight emitting layer including a low molecular weight or high molecularorganic material.

In an embodiment, the organic light emitting layer may emit light of oneof a red color, a green color and a blue color.

In such an embodiment, in an embodiment, the organic layer EL mayfurther include at least one of a hole transfer layer (“HTL”), a holeinjection layer (“HIL”), an electron transfer layer (“ETL”), and anelectron injection layer (“EFL”).

In an embodiment, the organic layer EL may cover at least part of theinsulating substrate 500. In such an embodiment, the organic layer ELmay at least partially cover the display area DA, the dam area D and thebarrier area BA.

The second electrode 202 may be disposed on the organic layer EL. In anembodiment, the second electrode 202 may be a cathode.

In an embodiment, the second electrode 202 may be a whole-surfaceelectrode covering an entire surface of the insulating substrate 500.

The second electrode 202 may cover the organic layer EL. In anembodiment where the organic layer EL covers the display area. DA, thenon-display area NDA, the dam area D and the barrier area BA, the secondelectrode 202 may cover the display area DA, the non-display area NDA,the dam area D and the barrier area BA.

In an embodiment, the second electrode 202 may be a transparentelectrode or a translucent electrode. In an embodiment, the secondelectrode 202 may include at least one of Li, Ca, LiF/Ca, LiF/Al, Al,Ag, and Mg. In an embodiment, the second electrode 202 may include or bemade of a metal thin film having a low work function.

In an embodiment, the transparent or translucent electrode may includeat least one of ITO, IZO, zinc oxide (ZnO), indium oxide (In₂O₃), IGOand AZO.

In an embodiment, the display device may be a top emission-type displaydevice in which light generated from the organic layer EL is emittedtoward the second electrode 202.

In an alternative embodiment, the display device may be a bottomemission-type display device in which light generated from the organiclayer EL is emitted toward the first electrode 201. In such anembodiment, the second electrode 202 may be a reflective electrode, andthe first electrode 201 may be a transparent or translucent electrode.

In another alternative embodiment, the display device may be adouble-sided emission-type display device in which light generated fromthe organic layer EL is emitted toward the first electrode 201 and thesecond electrode 202.

An encapsulation film 300 may be disposed on the second electrode 202.In an embodiment, the encapsulation film 300 may include a firstinorganic film 301, a first organic film 302, and a second inorganicfilm 303.

The first inorganic film 301 may include at least one of silicon oxide(SiOx), silicon nitride (SiNx), and silicon oxynitride (SiONx).

In an embodiment, as shown in FIGS. 3 and 4, the first inorganic film301 may have a single layer structure. However, the structure of thefirst inorganic film 301 is not limited to the single layer structure.In an alternative embodiment, the first inorganic film 301 may have amulti-layer structure including a stack of a plurality of functionalfilms.

In an embodiment, the first inorganic film 301 may be a film in which afilm made of silicon oxide (SiOx) and a film made of silicon nitride(SiNx) are alternately stacked one on another. The first organic film302 may be disposed on the first inorganic film 301. The first organicfilm 302 may be disposed on the first inorganic film 301 and may have athickness great enough to planarize a step formed by the pixel defininglayer PDL, for example, may have a thickness of about 30000 angstrom(Å).

In an embodiment, the first organic layer 302 may include at least oneof epoxy, acrylate and urethane acrylate.

The second inorganic film 303 may be disposed on the first organic film302. The second inorganic film 303 may include at least one of siliconoxide (SiOx), silicon nitride (SiNx), and silicon oxynitride (SiONx).

In FIG. 3, the second inorganic film 303 may have a single layerstructure. However, the structure of the second inorganic film 303 isnot limited to the single layer structure. In an alternative embodiment,the second inorganic film 303 may have a multi-layer structure includinga stack of a plurality of functional films. In an embodiment, the secondinorganic film 303 may be a film in which a film made of silicon oxide(SiOx) and a film made of silicon nitride (SiNx) are alternately stackedone on another.

Next, the dam area D will be described in detail.

The buffer layer 100, the gate insulating film GI and the interlayerinsulating film ILD may be disposed in the dam area D. In an embodiment,as shown in FIG. 3, an inorganic film consisting of three layers, thatis, the buffer layer 100, the gate insulating film GI and the interlayerinsulating film ILD is disposed in the dam area D. However, theinorganic film formed in the dam area D is not limited thereto. In analternative embodiment, an inorganic film consisting of at least onelayer may be disposed in the dam area D, and the at least one layer maybe made of a same material as one of the buffer layer 100, the gateinsulating film GI and the interlayer insulating film ILD.

The first dam D1 and the second dam D2 may be disposed on the interlayerinsulating film ILD. The first dam D1 is spaced apart from the throughhole H.

In an embodiment, the first dam D1 may define the barrier area BA. Insuch an embodiment, the barrier area BA may be defined as an areabetween the first dam D1 and the through hole H.

In an embodiment, the first dam D1 may include or be made of a samematerial as the pixel defining layer PDL of the display area DA. In suchan embodiment, the first dam D1 may be disposed on a same layer as thepixel defining layer PDL. In such an embodiment, the first dam D1 may beformed with the pixel defining layer PDL during a same process. However,the invention is not limited to this case. In an alternative embodiment,the first dam D1 may be formed independently of the pixel defining layerPDL.

The second dam D2 may be spaced apart from the first data D1. The seconddam D2 may be disposed between the display area DA and the first dam D1.A height of the second dam D2 may be different from that of the firstdam D1. The height of the second dam D2 may be less than that of thefirst dam D1. However, the invention is not limited thereto. In analternative embodiment, the height of the second dam D2 may besubstantially the same as that of the first dam D1.

In an embodiment, the second dam D2 may be made of a same material asthe passivation film 600 of the display area DA. In such an embodiment,the second dam D2 may be formed with the passivation film 600 during asame process. However, the invention is not limited thereto. In analternative embodiment, the second dam D2 may be formed independently ofthe passivation film 600.

The encapsulation film 300 may be disposed on the first dam D1 and thesecond dam D2.

The first inorganic film 301, the first organic film 302 and the secondinorganic film 303 may be disposed on the second dam D2.

In an embodiment, only the first inorganic film 301 and the secondinorganic film 303 may be disposed on the first dam D1, and the firstorganic film 302 may not be disposed on the first dam D1.

In such an embodiment, while an upper surface of the second dam D2overlaps the first organic film 302, an upper surface of the first damD1 may not overlap the first organic film 302.

In such an embodiment, the first inorganic film 301 and the secondinorganic film 303 may directly contact each other on the first dam D1.

Next, the barrier area BA will be described in detail.

In an embodiment, inorganic films may be removed from the barrier areaBA or may be partially present in the barrier area BA.

In an embodiment, the barrier area BA may include the first groove GR1,the second groove GR2 and the third groove GR3.

As described above with reference to FIG. 2, the outer circumferences ofthe first groove GR1, the second groove GR2 and the third groove GR3 mayhave shapes of concentric circles with different diameters. The firstgroove GR1, the second groove GR2 and the third groove GR3 may havesubstantially the same cross-sectional shape as each other.

In an embodiment, as shown in FIGS. 3 and 4, the first groove GR1, thesecond groove GR2 and the third groove GR3 have substantially the samewidth as each other. However, the invention is not limited thereto. Inan alternative embodiment, the first groove GR1, the second groove GR2,and the third groove GR3 may have different widths from each other.

Next, the hole area HA will be described in detail.

In an embodiment, as described above, the through hole H may be definedin the hole area HA. In an embodiment, both sidewalls defining thethrough hole H may be tapered. In such an embodiment, as illustrated inFIG. 4, a cross-section of the through hole H may become narrower fromthe upper surface of the insulating substrate 500 toward a lower surfaceof the insulating substrate 500.

The cross-sectional shape of the first groove GR1 will now be describedin greater detail with reference to FIG. 5.

FIG. 5 is an enlarged view of a portion of FIG. 3.

Referring to FIG. 5, the first groove GR1 may include a first sidewallSW1, a bottom surface BS and a second sidewall SW2.

The bottom surface BS may be disposed between the first sidewall SW1 andthe second sidewall SW2.

In an embodiment, the bottom surface BS may be defined by an uppersurface of the inorganic layer 400. In such an embodiment, the firstgroove GR1 may pass through the second substrate 502 but may not passthrough the inorganic layer 400 and the first substrate 501. In such anembodiment, the bottom surface BS may be defined by the inorganic layer400, and the first sidewall SW1 and the second sidewall SW2 may bedefined by side walls of the second substrate 502.

In an embodiment, a height of the first groove GR1, that is, a distancefrom the upper surface of the second substrate 502 to the bottom surfaceBS may be 5.8 micrometers (μm) or greater.

In an embodiment, the first sidewall SW1 may form a first angle θ1 withthe bottom surface BS. Here, the first angle θ1 may be an acute angle.When the first angle θ1 is an acute angle, the first sidewall SW1extending from the upper surface of the second substrate 502 may slopesteeply.

The second sidewall SW2 may form a second angle θ2 with the bottomsurface BS. In an embodiment, the sum of the second angle θ2 and thefirst angle θ1 may be about 180 degrees.

In such an embodiment, the second sidewall SW2 and the first sidewallSW1 may extend parallel to each other.

This will be described later in terms of slope. The slope of a sidewallmay be defined in cross-section. In an embodiment, the slope may bedefined as a value obtained by dividing the amount of change in a y-axisdirection by the amount of change in an x-axis direction in a coordinateplane system consisting of the x-axis and the y-axis shown in FIG. 5.Herein, the slope refers to the degree to which a plane or line isinclined with respect to the x-axis.

In such an embodiment, each of the first sidewall SW1 and the secondsidewall SW2 may have a positive slope or a negative slope. In such anembodiment, the first sidewall SW1 and the second sidewall SW2 may havesubstantially the same slope as each other.

In an embodiment, each of the first sidewall SW1 and the second sidewallSW2 has a positive slope, as shown in FIG. 5. In an alternativeembodiment, each of the first sidewall SW1 and the second sidewall SW2has a negative slope as shown in FIG. 6.

The organic layer EL may be disposed on the second substrate 502 and thefirst groove GR1. The organic layer EL disposed on the insulatingsubstrate 500 may become a path along which moisture flows, such thatmoisture generated around the through hole H may flow into the displayarea DA through the organic layer EL, thereby causing a display defect.

In an embodiment, the organic layer EL is configured to be interruptedto prevent moisture from flowing into the display area DA through theorganic layer EL. Here, the term ‘interrupt’ may be used in the sense ofbreaking the continuity of a continuous element. That is, if acontinuous element is interrupted, it may become discontinuous, suchthat the element is divided into a plurality of portions disconnectedfrom each other.

The organic layer EL may not be effectively interrupted when formed on astructure having a gentle slope due to high coverage thereof. When thefirst sidewall SW1 has a steep slope, the organic layer EL may beeffectively interrupted, thus preventing moisture from flowing into thedisplay area DA through the organic layer EL.

Accordingly, in an embodiment, interruption portions at which theorganic layer EL is interrupted may be disposed in the barrier area BA.

In an embodiment, as shown in FIGS. 3 and 4, a first interruptionportion CP1, a second interruption portion CP2 and a third interruptionportion CP3 are defined in the barrier area BA to correspond to thefirst groove GR1, the second groove GR2 and the third groove GR3,respectively, but not being limited thereto. Alternatively, the numberof interruption portions corresponding to grooves may be variouslymodified based on the number of grooves provided therein.

Hereinafter, the first interruption portion CP1 will be described indetail with reference to FIG. 5. Since the second interruption portionCP2 and the third interruption portion CP3 are substantially identicalto the first interruption portion CP1, any repetitive detaileddescription thereof will be omitted for convenience of description.

In an embodiment, as shown in FIG. 5, the first interruption portion CP1may be defined by the first sidewall SW1.

The first interruption portion CP1 that interrupts the organic layer ELmay have a structure, in which a portion of the first sidewall SW1 maycontact the organic layer EL, the remaining portion of the firstsidewall SW1 may not contact the organic layer EL, and the whole of thebottom surface BS and the whole of the second sidewall SW2 may contactthe organic layer EL.

The second electrode 202 may be disposed on the organic layer EL. In anembodiment, the second electrode 202 may be interrupted at the firstinterruption portion CP1. Accordingly, the second electrode 202 maydirectly contact the first sidewall SW1. The bottom surface BS and thesecond sidewall SW2 may not directly contact the second electrode 202due to the organic layer EL.

In such an embodiment, the organic layer EL may not cover a portion ofthe first sidewall SW1, thus exposing the portion of the first sidewallSW1.

The first inorganic film 301 may be disposed on the second electrode202. In an embodiment, the first inorganic film 301 may directly contacta portion of the first sidewall SW1 exposed by the second electrode 202and the organic layer EL.

The second inorganic film 303 may be disposed on the first inorganicfilm 301. In such an embodiment, the first inorganic film 301 and thesecond inorganic film 303 may directly contact each other in the barrierarea BA.

The second groove GR2 and the third groove GR3 may have substantiallythe same shape as the first groove GR1. Therefore, any repetitivedetailed description of the second groove GR2 and the third groove GR3will be omitted.

Referring back to FIG. 4, the through hole H may be disposed inside thebarrier area BA. The through hole H may be defined entirely through theinsulating substrate 500. Accordingly, an empty space may be defined inthe hole area HA.

Hereinafter, alternative embodiments of display device will be describedin detail. Hereinafter, elements of such embodiments that are identicalto those described above are indicated by like reference numerals, andany repetitive detailed description thereof will be omitted orsimplified.

FIG. 6 is a partial enlarged view of a display device according to analternative embodiment. Referring to FIG. 6, in an embodiment, a firstsidewall SW1_1 forms a first angle θ1 with a bottom surface BS1, and asecond sidewall SW2_1 forms a second angle θ2 with the bottom surfaceBS1 in the first groove GR1_1. The embodiment shown in FIG. 6 issubstantially the same as the embodiment shown in FIG. 5 except that thesecond angle θ2 formed by the second sidewall SW2_1 and the bottomsurface BS1 is an acute angle.

In such an embodiment, the first angle θ1 formed by the first sidewallSW1_1 and the bottom surface BS1 may be an obtuse angle, and the secondangle θ2 formed by the second sidewall SW2_1 and the bottom surface BS1may be an acute angle.

In such an embodiment, a first interruption portion CP1_1 may be definedat the second sidewall SW2_1. In such an embodiment, an organic layer ELmay be interrupted. Accordingly, a portion of the second sidewall SW2_1may contact the organic layer EL, and the remaining portion of thesecond sidewall SW2_1 may not contact the organic layer EL. In such anembodiment, the whole of the bottom surface BS and the whole of thefirst sidewall SW1_1 may contact the organic layer EL.

A second electrode 202 may be disposed on the organic layer EL. In anembodiment, the second electrode 202 may be interrupted at the firstinterruption portion CP1_1. Accordingly, the second electrode 202 maydirectly contact the second sidewall SW2_1. The bottom surface BS andthe first sidewall SW1_1 may not directly contact the second electrode202 due to the organic layer EL.

In such an embodiment, the organic layer EL may not cover a portion ofthe second sidewall SW2_1, thus exposing the portion of the secondsidewall SW2_1.

A first inorganic film 301 may be disposed on the second electrode 202.In an embodiment, the first inorganic film 301 may directly contact aportion of the second sidewall SW2_1 exposed by the second electrode 202and the organic layer EL.

FIG. 7 is a cross-sectional view of a display device according toanother alternative embodiment.

Referring to FIG. 7, an insulating film may be disposed in a portion ofa barrier area BA where no grooves are defined.

In an embodiment, a buffer layer 100, a gate insulating film GI and aninterlayer insulating film ILD may be disposed in a portion of thebarrier area BA where a first groove GR1, a second groove GR2 and athird groove GR3 are not defined.

In an embodiment, as shown in FIG. 7, all of the buffer layer 100, thegate insulating film GI and the interlayer insulating film ILD aredisposed in the portion of the barrier area BA where the first grooveCR1, the second groove GR2 and the third groove GR3 are not defined.However, the invention is not limited to this case.

In an alternative embodiment, at least one of the buffer layer 100, thegate insulating film GI and the interlayer insulating film ILD may bedisposed in the portion of the barrier area BA where the first grooveGR1, the second groove GR2 and the third groove GR3 are not defined. Insuch an embodiment, at least one of the buffer layer 100, the gateinsulating film GI and the interlayer insulating film ILD may beomitted.

FIG. 8 is a schematic plan view of a display device according to analternative embodiment. FIG. 9 is an enlarged view of a portion ‘B’ ofFIG. 8. FIG. 10 is a cross-sectional view taken along line III-III′ ofFIG. 9.

Referring to FIGS, 8 through 10, in an embodiment, a through hole HI maybe disposed in a non-display area NDA.

Referring to FIG. 8 through FIG. 10, the through hole H1 may be definedthrough an insulating substrate 500 in the non-display area NDA. Abarrier area BA and a dam area D may be disposed around a hole area HAoccupied by the through hole H1. In such an embodiment, the barrier areaBA and the dam area D are substantially the same as those describedabove with reference to FIG. 2, and any repetitive detailed descriptionsthereof will be omitted.

The non-display area NDA may be disposed outside the dam area D.Referring to FIG. 10, a first insulating film 801, a second insulatingfilm 802, and a third insulating film 803 may be formed on a secondsubstrate 502 in the non-display region NDA and the dam area D.

In an embodiment, the first insulating film 801 may include or be madeof the same material as a buffer layer 100 of a display area DA, thesecond insulating film 802 may include or be made of the same materialas a gate insulating film GI of the display area DA, and the thirdinsulating film 803 may include or be made of the same material as apassivation film 600 of the display area DA.

In an embodiment, as shown in FIG. 10, an insulating film consisting ofthree layers is disposed in the non-display region NDA and the dam areaD. However, the structure of the insulating film is not limited thereto.The insulating film may have a single layer structure or a multi-layerstructure including a stack of four or more layers.

A first inorganic film 301 and a second inorganic film 303 may bedisposed on the third insulating film 803 in the non-display area NDA.In such an embodiment, the first inorganic film 301 and the secondinorganic film 303 may directly contact each other in the non-displayarea NDA.

However, the invention is not limited to this case. In an alternativeembodiment, a first organic film 302 may be disposed between the firstinorganic film 301 and the second inorganic film 303 (see FIG. 3).

A first dam D1 and a second dam D2 may be disposed on the thirdinsulating film 803 in the dam area D. Since the first dam D1 and thesecond dam D2 are substantially the same as those described above withreference to FIG. 3, and any repetitive detailed descriptions thereofwill be omitted.

FIG. 11 is a schematic plan view of a display device according toanother alternative embodiment. FIG. 12 is an enlarged view of a portion‘C’ of FIG. 11.

Referring to FIG. 11, in an embodiment, a through hole H2 may have aquadrilateral shape. In embodiments of the invention, the shape of thethrough hole H2 is not limited to a circular shape as described above.

Referring to FIG. 12, in an embodiment where the through hole H2 has aquadrilateral shape, a first groove GR1_2, a second groove GR2_2 and athird groove GR3_2 surrounding the through hole H2 may have aquadrilateral shape. In such an embodiment, the planar shape of thethrough hole H2 may be similar to the planar shapes of the first grooveGR1_2, the second groove GR2_2 and the third groove GR3_2.

In such an embodiment where the through hole H2 has a quadrilateralshape, the planar shape of each of a first data D1_2 and a second damD2_2 may be a quadrilateral shape. The planar shape of the through holeH2 may be similar to the planar shapes of the first dam D1_2 and thesecond dam D2_2.

In an embodiment, as shown in FIG. 12, the planar shapes of the firstgroove GR1_2, the second groove GR2_2, the third groove GR3_2, the firstdam D1_2 and the second dam D2_2 are quadrilateral shapes, and thethrough hole H2 has a quadrilateral shape. However, the planar shapes ofthe first groove the second groove GR2_2, the third groove GR3_2, thefirst dam D1 and the second dam D2 are not limited thereto.

In an alternative embodiment, the through hole H2 may have aquadrilateral shape, and the planar shapes of the first groove GR1_2,the second groove GR2_2, the third groove GR3_2, the first dam D1_2 andthe second dam D2_2 may be circular shapes as in FIG. 2.

Hereinafter, an embodiment of a method of manufacturing a display devicewill be described. Some of the elements described below may be the sameas or similar to those in the embodiments of the display devicedescribed above, and thus any repetitive detailed description of thesame or similar elements will be omitted.

FIGS. 13 to 19 are views illustrating a method of manufacturing adisplay device according to an embodiment. Referring to FIGS. 13 through20, an embodiment of the method of manufacturing a display deviceincludes providing one or more dams D1 and D2 on a first area A1 of aninsulating substrate 500 which is disposed on a carrier substrate G andin which the first area A1, a second area A2 and a third area A3 aredefined; forming a laser cutting portion LC by irradiating a laser beamto the third area A3 in a first direction; forming one or more groovesin the insulating substrate 500 by irradiating a laser beam to thesecond area A2 in a second direction different from the first direction;and providing an organic layer EL on the insulating substrate 500 topartially cover the grooves.

Referring to FIG. 13, one or more dams D1 and D2 are provided on thefirst area A1 of the insulating substrate 500 in which the first areaA1, the second area A2 and the third area A3 are defined.

The insulating substrate 500 may be disposed on the carrier substrate G.The carrier substrate G may include a glass.

In an embodiment, the planar shape of the third area A3 may be acircular shape. In such an embodiment, a through hole H may be formed inthe third area A3 during a subsequent process.

In such an embodiment, the third area A3 may correspond to the hole areaHA of FIG. 2 or 12.

In such an embodiment, the first area A1 may correspond to the dam areaD of FIG. 2 or 12, and the second area A2 may correspond to the barrierarea BA of FIG. 2 or 12.

In an embodiment, one or more insulating films may be provided in thefirst area A1. The insulating films may include one or more of a firstinsulating film 801, a second insulating film 802 and a third insulatingfilm 803.

In such an embodiment, no insulating film may be disposed in the secondarea A2 and the third area A3. In an embodiment, the insulating filmsmay be provided over the entire surface of the insulating substrate 500,and then portions thereof corresponding to the second area A2 and thethird area A3 may be removed. In an alternative embodiment, theinsulating films may be formed only in the first area A1 using a mask.

In an embodiment, as shown in FIG. 13, no insulating film is provided inthe second area A2 and the third area A3. However, the invention is notlimited thereto. In an alternative embodiment, one or more of the firstinsulating film 801, the second insulating film 802 and the thirdinsulating film 803 may be provided in the second area A2 and the thirdarea A3 as in the first area A1.

In such an embodiment, a structure obtained through such processes to bedescribed later may be as that illustrated in FIG. 7.

A first dam D1 and/or a second dam D2 may be provided on the thirdinsulating film 803 of the first area A1.

In an embodiment, the first dam D1 may be formed with a pixel defininglayer PDL of a display area DA during a same process, but not beinglimited thereto. In such an embodiment, the second dam D2 may be formedwith a passivation film 600 of the display area DA during a same process(see FIG. 3).

Referring to FIG. 14, the laser cutting portion LC may be formed byirradiating a laser beam to the third area A3 of the insulatingsubstrate 500 in the first direction.

In an embodiment, the first direction may be a thickness direction ofthe insulating substrate 500, that is, a direction perpendicular to theinsulating substrate 500. A first laser beam L1 irradiated in the firstdirection may completely penetrate the insulating substrate 500. In suchan embodiment, the first laser beam L1 may form the laser cuttingportion LC that completely passes through a first substrate 501, aninorganic layer 400 and a second substrate 502.

In an embodiment, the laser cutting portion LC may be shaped like a ringas illustrated in FIG. 15. In an alternative embodiment, the lasercutting portion LC may be shaped like a frame.

When the laser cutting portion LC is formed into a ring shape, an islandpattern 50 may be formed inside the laser cutting portion LC. The islandpattern 50 may be removed subsequently.

Referring to FIG. 16, one or more grooves GR1 through GR3, each having afirst sidewall SW1, a second sidewall SW2 and a bottom surface BS, areformed in the insulating substrate 500 through the second substrate 502by irradiating a laser beam to the second area A2 in the seconddirection different from the first direction.

The second direction may be different from the first direction. Areference plane RL is defined to describe the second direction. Thereference plane RL may be an imaginary plane parallel to an uppersurface of the insulating substrate 500.

The second direction, which is the irradiation direction of a secondlaser beam L2, may form a third angle θ3 with the reference plane RL. Inan embodiment, the third angle θ3 may be substantially the same as afirst angle θ1 formed by the first sidewall SW1 and the bottom surfaceBS.

In such an embodiment, the first angle θ1 and the third angle θ3 may bean acute angle.

The second laser beam L2 irradiated onto the insulating substrate 500may penetrate the second substrate 502. However, the second laser beamL2 may not penetrate the inorganic layer 400 and the first substrate 501because the inorganic layer 400 functions as a blocking layer.

The first groove GR1, the second groove GR2 and the third groove GR3formed by the second laser beam L2 are substantially the same as thosedescribed above with reference to FIG. 5 or 6. Thus, any repetitivedetailed description of the first groove GR1, the second groove GR2 andthe third groove GR3 will be omitted.

In an embodiment, the second laser beam L2 may be provided in aplurality. In an embodiment, as shown in FIG. 16, the number of thesecond laser beams L2 is three. However, the number of the second laserbeams L2 is not limited to three. In an alternative embodiment, thenumber of the second laser beams L2 may be one or may be four or more.

Referring to FIG. 17, an embodiment of the method of manufacturing adisplay device may further include providing the organic layer EL on theinsulating substrate 500, providing a second electrode 202 on theorganic layer EL, and providing an encapsulation film 300 on the secondelectrode 202.

In one embodiment, for example, the organic layer EL may be formed by achemical vapor deposition method or an inkjet method, but not beinglimited thereto.

The organic layer Et may be provided or formed on the insulatingsubstrate 500. Interruption portions CP1 through CP3 that interrupt theorganic layer EL may be defined by one or more grooves formed in thesecond area A2, as described above with reference to FIG. 4.

In an embodiment, the second electrode 202 may be firmed using achemical vapor deposition method.

The second electrode 202 may have substantially the same structure asthat of FIG 3.

The encapsulation film 300 may be provided or formed on the secondelectrode 202. The encapsulation film 300 may include a first inorganicfilm 301, a first organic film 302 and a second inorganic film 303. Theencapsulation film 300 may be substantially the same as that of FIG. 3.

Referring to FIG. 18, an embodiment of the method of manufacturing adisplay device may further include detaching the carrier glass G fromthe insulating substrate 500, and attaching a protective film PF to theinsulating substrate 500.

In the detaching of the carrier glass G, the island pattern 50 may beremoved or may be left as illustrated in FIG. 18. However, even if theisland pattern 50 is left, the island pattern will be removed during asubsequent process where the protective film PF is cut.

The protective film PF may be attached to a lower surface of theinsulating substrate 500 to ensure stability in subsequent processesafter the detaching the carrier glass G.

Referring to FIGS. 19 and 20, an embodiment of the method ofmanufacturing a display device may further include cutting theprotective film PF.

In an embodiment, a portion of the protective film PF which correspondsto the third area A3 may be cut off. When the protective film PF is cut,the remaining island pattern 50 in the third area A3 thereon may beremoved. Accordingly, the through hole H may be formed in the third areaA3. The protective film PF may be cut along the laser cutting portionLC. As a result, the through hole H without the island pattern 50 may beformed as illustrated in FIG. 20.

In embodiments of the invention, moisture is effectively prevented frompenetrating into a display area such that a display defect may beeffectively prevented from occurring.

However, the effects of the embodiments are not limited to those forthherein. The above and other effects of the embodiments will become moreapparent to one of ordinary skill in the art to which the embodimentspertain by referencing the claims.

While the invention has been particularly illustrated and described withreference to exemplary embodiments thereof, it will be understood bythose of ordinary skill in the art that various changes in form anddetail may be made therein without departing from the spirit and scopeof the invention as defined by the following claims. The exemplaryembodiments should be considered in a descriptive sense only and not forpurposes of limitation.

What is claimed is:
 1. A display device comprising: an insulatingsubstrate, wherein a through hole is defined through the insulatingsubstrate; and an organic layer which covers the insulating substrate,wherein a barrier area surrounding the through hole is defined in theinsulating substrate, and an interruption portion, at which the organiclayer is interrupted, is defined in the barrier area.
 2. The displaydevice of claim 1, wherein a groove is defined on the insulatingsubstrate in the barrier area.
 3. The display device of claim 2, whereinthe groove comprises a first sidewall and a second sidewall spaced apartfrom each other, and the interruption portion is defined by the firstsidewall.
 4. The display device of claim 3, wherein a slope of the firstsidewall and a slope of the second sidewall are substantially the sameas each other.
 5. The display device of claim 3, further comprising: anelectrode which covers the organic layer, wherein the electrode isinterrupted at the interruption portion.
 6. The display device of claim5, wherein the electrode contacts the first sidewall and does notcontact the second sidewall.
 7. The display device of claim 2, wherein adisplay area, which displays an image, and a non-display area, which isdisposed outside the display area, are defined in the insulatingsubstrate, and the through hole is defined in the display area.
 8. Thedisplay device of claim 2, wherein the insulating substrate comprises afirst substrate, an inorganic layer and a second substrate, which arestacked sequentially one on another, and the groove is defined in thesecond substrate.
 9. The display device of claim 2, wherein a planarshape of the groove is a ring shape surrounding the through hole. 10.The display device of claim 1, wherein a dam area surrounding thebarrier area is defined in the insulating substrate outside the barrierarea, and a dam is disposed on the insulating substrate in the dam area.11. The display device of claim 10, wherein the dam is provided inplural, and the dams comprise a first dam, and a second dam spaced apartfrom the first dam.
 12. The display device of claim 1, wherein a displayarea, which displays an image, and a non-display area, which is disposedoutside the display area, are defined in the insulating substrate, andthe through hole is defined in the display area.
 13. The display deviceof claim 12, wherein the display area comprises a first electrode, and asecond electrode opposite to the first electrode, and the organic layeris disposed between the first electrode and the second electrode. 14.The display device of claim 12, wherein the organic layer comprises anorganic light emitting layer.
 15. The display device of claim 1, whereina display area, which displays an image, and a non-display area, whichis disposed outside the display area, are defined in the insulatingsubstrate, and the through hole is defined in the non-display area. 16.A method of manufacturing a display device, the method comprising:providing a dam on a first area of an insulating substrate, wherein theinsulating substrate is disposed on a carrier substrate, and the firstarea, a second area and a third area are defined in the insulatingsubstrate; forming a laser cutting portion by irradiating a laser beamto the third area in a first direction; forming a groove in theinsulating substrate by irradiating a laser beam to the second area in asecond direction different from the first direction; and providing anorganic layer on the insulating substrate to at least partially coverthe groove, wherein an interruption portion, at which the organic layeris interrupted, is formed in the second area.
 17. The method of claim16, further comprising: detaching the carrier substrate from theinsulating substrate; and attaching a protective film to a lower surfaceof the insulating substrate.
 18. The method of claim 17, furthercomprising: forming a through hole by cutting off a portion of theprotective film corresponding to the third area.
 19. The method of claim16, wherein the groove comprises a first sidewall and a second sidewall,which are spaced apart from each other, and the interruption portion isdefined by the first sidewall.
 20. The method of claim 16, furthercomprising: providing an electrode on the insulating substrate to coverthe organic layer.